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March 1999
FDG6323L Integrated Load Switch
General Description
This device is particularly suited for compact power management in portable electronic equipment where 2.5V to 8V input and 0.6A output current capability are needed. This load switch integrates a small N-Channel power MOSFET (Q1) which drives a large P-Channel power MOSFET (Q2) in one tiny SC70-6 package.
Features
VDROP=0.2V @ VIN=5V, IL=0.36A. R(ON) = 0.55 VDROP=0.2V @ VIN=2.5V, IL=0.27A. R(ON) = 0.75.
Very small package outline SC70-6. Control MOSFET (Q1) includes Zener protection for ESD ruggedness (>6KV Human Body Model).
High density cell design for extremely low on-resistance.
Compact industry standard SC70-6 surface mount package.
SC70-6
SOT-23
SuperSOTTM-6
SuperSOTTM-8
SO-8
SOT-223
V IN , R1
4
Q2
3
VOUT , C1
EQUIVALENT APPLICATION
.23
VON/OFF
5
Q1
2
VOUT , C1
IN
+
VDROP
-
OUT
pin 1
R1 , C1
6
See Application Circuit
1
R2
ON/OFF
SC70-6
Absolute Maximum Ratings
Symbol Parameter
TA = 25C unless otherwise noted
FDG6323L
Units
VIN VON/OFF IL
Input Voltage Range On/Off Voltage Range Load Current - Continuous - Pulsed
(Note 1) (Note 1 & 3) (Note 2)
2.5 - 8 1.5 - 8 0.6 1.8 0.3 -55 to 150 6
V V A
PD TJ,TSTG ESD
Maximum Power Dissipation
W C kV
Operating and Storage Temperature Range Electrostatic Discharge Rating MIL-STD-883D Human Body Model (100pf/1500Ohm)
THERMAL CHARACTERISTICS
RJA
Thermal Resistance, Junction-to-Ambient
(Note 2)
415
C/W
(c) 1999 Fairchild Semiconductor Corporation
FDG6323L Rev.C
Electrical Characteristics (T
Symbol Parameter OFF CHARACTERISTICS
A
= 25C unless otherwise noted)
Conditions
Min
Typ
Max
Units
IFL VDROP R(ON) IL
Notes:
Forward Leakage Current
VIN = 8 V, VON/OFF = 0 V VIN = 5 V, VON/OFF = 3.3 V, IL = 0.36 A VIN = 2.5 V, VON/OFF = 3.3 V, IL = 0.27 A VGS = -5 V, ID = -0.6 A VGS = -2.5 V, ID = -0.5 A VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V VDROP = 0.2 V, VIN = 2.5 V, VON/OFF = 3.3 V 0.36 0.27 0.14 0.15 0.41 0.58
1
A
ON CHARACTERISTICS (Note 3)
Conduction Voltage Drop
0.2 0.2 0.55 0.75
V
Q2 - Static On-Resistance Load Current
A
1. Range of Vin can be up to 8V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -8V. 2. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design. 3. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%
FDG6323L Load Switch Application
APPLICATION CIRCUIT Q2
IN
R1 C1
OUT
Q1
ON/OFF
Co LOAD
R2
External Component Recommendation
R1 is required to turn Q2 off. R2 is optional for Slew Rate Control. For Co 1uF applications: First select R2,100 - 1K, for Slew Rate control. Then select R1 such that R1/R2 ratio maintains between 10 - 100.
FDG6323L Rev.C
Typical Electrical Characteristics (TA = 25 OC unless otherwise noted )
1.5
V IN = 5V VON/OFF = 1.5 - 8V PW =300us, D 2%
1.5
TJ = 125C
1.2 VDROP ,(V)
1.2 VDROP , (V)
T = 25C J
0.9
T = 125C J
0.9
0.6
T = 25C J
0.6
V IN = 2.5V VON/OFF = 1.5 - 8V PW =300us, D 2%
0.3
0.3
0 0 0.4 0.8 IL ,(A) 1.2 1.6 2
0
0
0.4
0.8 IL , (A)
1.2
1.6
2
Figure 1. Conduction Voltage Drop Variation with Load Current.
1
Figure 2. Conduction Voltage Drop Variation with Load Current.
I L = 1A V ON/OFF = 1.5 - 8V PW =300us, D 2%
0.8 R (ON) ,(Ohm)
0.6
T = 125C J
0.4
T = 25C J
0.2
0
2
4 VIN , (V)
6
8
10
Figure 3. On-Resistance Variation with Input Voltage.
1 TRANSIENT THERMAL RESISTANCE
r(t), NORMALIZED EFFECTIVE
0.5 0.2 0.1 0.05 0.02 0.01 0.005
D = 0.5 0.2 0.1 0.05 0.02 0.01 Single Pulse P(pk)
R JA (t) = r(t) * R JA R JA =415 C/W
t1
t2
TJ - TA = P * R JA (t) Duty Cycle, D = t 1/ t 2
0.002 0.0001
0.001
0.01
0.1 t 1, TIME (sec)
1
10
100
200
Figure 4. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 2. Transient thermal response will change depending on the circuit board design.
FDG6323L Rev.C
SC70-6 Tape and Reel Data and Package Dimensions
SC70-6 Packaging Configuration: Figure 1.0
Customized Label
Packaging Description:
SC70-6 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 3,000 units per 7" or 177cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 10,000 units per 13" or 330cm diameter reel. This and some other options are described in the Packaging Information table. These full reels are individually barcode labeled and placed inside a pizza box (illustrated in figure 1.0) made of recyclable corrugated brown paper with a Fairchild logo printing. One pizza box contains three reels maximum. And these pizza boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped.
Antistatic Cover Tape
F63TNR Static Dissipative Label Embossed Carrier Tape
21 21
SC70-6 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard (no flow code) TNR 3,000 7" Dia 184x187x47 9,000 0.0055 0.1140 D87Z TNR 10,000 13" 343x343x64 30,000 0.0055 0.3960
21
21
21
Pin 1
SC70-6 Unit Orientation
343mm x 342mm x 64mm Intermediate box for D87Z Option
F63TNR Barcode Label
F63TNR Label
F63TNR Label sample 184mm x 187mm x 47mm Pizza Box for Standard Option F63TNR Label
LOT: CBVK741B019 FSID: FDG6302P QTY: 3000 SPEC:
D/C1: D9842 D/C2:
QTY1: QTY2:
SPEC REV: CPN: N/F: F
(F63TNR)3
SC70-6 Tape Leader and Trailer Configuration: Figure 2.0
Carrier Tape Cover Tape
Components Trailer Tape 300mm minimum or 75 empty pockets Leader Tape 500mm minimum or 125 empty pockets
August 1999, Rev. C
SC70-6 Tape and Reel Data and Package Dimensions, continued
SC70-6 Embossed Carrier Tape Configuration: Figure 3.0
T E1
P0
D0
F K0 Wc B0 E2 W
Tc A0 P1 D1
User Direction of Feed
Dimensions are in millimeter Pkg type SC70-6 (8mm)
A0
2.24 +/-0.10
B0
2.34 +/-0.10
W
8.0 +/-0.3
D0
1.55 +/-0.05
D1
1.125 +/-0.125
E1
1.75 +/-0.10
E2
6.25 min
F
3.50 +/-0.05
P1
4.0 +/-0.1
P0
4.0 +/-0.1
K0
1.20 +/-0.10
T
0.255 +/-0.150
Wc
5.2 +/-0.3
Tc
0.06 +/-0.02
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum Typical component cavity center line
0.5mm maximum
B0 20 deg maximum component rotation
0.5mm maximum
Sketch A (Side or Front Sectional View)
Component Rotation
A0 Sketch B (Top View)
Typical component center line
Sketch C (Top View)
Component lateral movement
SC70-6 Reel Configuration: Figure 4.0
Component Rotation
W1 Measured at Hub
Dim A Max
Dim A max
Dim N
See detail AA
7" Diameter Option
B Min Dim C See detail AA W3
Dim D min
13" Diameter Option
W2 max Measured at Hub DETAIL AA
Dimensions are in inches and millimeters
Tape Size
8mm
Reel Option
7" Dia
Dim A
7.00 177.8 13.00 330
Dim B
0.059 1.5 0.059 1.5
Dim C
0.512 +0.020/-0.008 13 +0.5/-0.2 0.512 +0.020/-0.008 13 +0.5/-0.2
Dim D
0.795 20.2 0.795 20.2
Dim N
2.165 55 4.00 100
Dim W1
0.331 +0.059/-0.000 8.4 +1.5/0 0.331 +0.059/-0.000 8.4 +1.5/0
Dim W2
0.567 14.4 0.567 14.4
Dim W3 (LSL-USL)
0.311 - 0.429 7.9 - 10.9 0.311 - 0.429 7.9 - 10.9
8mm
13" Dia
July 1999, Rev. C
SC70-6 Tape and Reel Data and Package Dimensions, continued
SC70-6 (FS PKG Code 76)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in: inches [millimeters]
Part Weight per unit (gram): 0.0055
September 1998, Rev. A1
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GTOTM HiSeCTM
DISCLAIMER
ISOPLANARTM MICROWIRETM POPTM PowerTrenchTM QFETTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8
TinyLogicTM UHCTM VCXTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.

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